RFICs packages electrical performance comparison of both ULTRA-CSP and Standard TSOP

The requirement for low cost, small size and high density for high-speed system drives the design of packages to smaller package size. ULTRA CSP is an advanced technology to meet the above targets. ULTRA CSP is a wafer level package developed by FCT. Under high frequency operation, the parasitics associated with the package will significantly degrade the package performance. An unsuitable package may cause resonance, coupling, impedance mismatch and frequency dependent loss. So, providing accurate package parasitics is critical to the success of the system design. In this paper, the electrical model of ULTRA CSP has been established based on the S-parameter simulation. When compared with the TSOP package, ULTRA-CSP shows smaller parasitics in the equivalent model. This paper also compares the performance of the ULTRA-CSP and Standard TSOP from the view point of propagation delay, crosstalk noise, insertion loss, return loss and maximum allowable working frequency. Based on the analysis result, is provided the package layout guideline for designer reference.