DocumentCode
3277003
Title
Line characterization and resonance mitigation in ceramic packages
Author
Dunn, John M.
fYear
1996
fDate
28-30 Oct 1996
Firstpage
74
Lastpage
76
Abstract
This paper develops models for the characteristic impedance and effective permittivity of microstrip lines near ceramic walls, as well as a method for resonance suppression using lossy vias in ceramic packages
Keywords
ceramics; electric impedance; microstrip circuits; microstrip lines; microwave circuits; packaging; permittivity; resonance; ceramic packages; ceramic walls; characteristic impedance; effective permittivity; line characterization; lossy vias; microstrip lines; resonance mitigation; resonance suppression;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564785
Filename
564785
Link To Document