Title :
An original modeling process and technology with intra-package crosstalk consideration for compact array antennas on the 4G communications packages
Author :
Kamal, Ahmed F. ; Wong, C.P. ; Copeland, John A.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The effect of electromagnetic interference arising from different layers, structures, and properties of smart antenna array elements on 4G systems is presented. Novel modeling issues resulted from the analysis shows possibility to reduce package size, introduce new package architecture, and improve the performance of the package.
Keywords :
4G mobile communication; adaptive antenna arrays; antenna theory; crosstalk; electromagnetic interference; microstrip antenna arrays; modelling; packaging; 10.5 GHz; 4G communications packages; EMI; compact array antennas; electromagnetic interference; intra-package crosstalk; modeling process; modeling technology; package architecture; substrate layer effects; Adaptive arrays; Antenna arrays; Antenna feeds; Crosstalk; Electromagnetic interference; Frequency; Materials science and technology; Microstrip antennas; Packaging; System testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185593
