DocumentCode
3277026
Title
Hygrothermal aging of a filled epoxy resin
Author
Brun, E. ; Rain, P. ; Teissèdre, G. ; Guillermin, C. ; Rowe, S.
Author_Institution
Schneider Electr., Grenoble
fYear
2007
fDate
8-13 July 2007
Firstpage
239
Lastpage
242
Abstract
The hygrothermal conditioning of an epoxy resin at 80degC under 80% RH has been followed by weight measurements, therm ogravimetric analysis (TGA) and dynamical mechanical analysis (DMA). The samples are either filled with 60% by weight of silica flour or are not filled. Above an apparent saturation value of about 1.5% reached within a few days, a slight but significant mass uptake was observed in the filled resin, especially after 50 days. The TGA showed an evolution of the filled samples with conditioning after 50 days as well, which was not observed on unfilled samples. For the filled samples, the elastic modulus in the rubbery state decreased with conditioning. These evolutions have been attributed to the formation of a degraded inter-phase region due to hydrolysis occurring after the debonding of the filler-matrix interface caused by the absorbed water.
Keywords
ageing; bonding processes; elastic moduli; epoxy insulation; filled polymers; moisture; thermal analysis; debonding; dynamical mechanical analysis; elastic modulus; filled epoxy resin; hydrolysis; hygrothermal aging; temperature 80 degC; thermogravimetric analysis; time 50 day; Aging; Chemicals; Degradation; Dielectric materials; Epoxy resins; Glass; Silicon compounds; Solids; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics, 2007. ICSD '07. IEEE International Conference on
Conference_Location
Winchester
Print_ISBN
1-4244-0750-8
Electronic_ISBN
1-4244-0751-6
Type
conf
DOI
10.1109/ICSD.2007.4290796
Filename
4290796
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