Design of on-package microstrip antennas for single-chip wireless transceivers

Author

Zhang, Y.P.

Author_Institution

Sch. of EEE, Nanyang Technol. Univ., Singapore, Singapore

fYear

2002

fDate

10-12 Dec. 2002

Firstpage

40

Lastpage

44

Abstract

The recent advances in single-chip solutions of wireless transceivers have called for the parallel development of compact and efficient antennas. This paper addresses the design of on-package microstrip, antennas for single-chip wireless transceivers. A microstrip antenna realized in the format of an integrated circuit ceramic ball grid array (CBGA) package measures only 15×15×1.9 mm. Results show that the on-package microstrip antenna achieved impedance bandwidth of 1% and radiation efficiency of 80%, and gain of 2 dBi at 5.6 GHz. Details of design and analysis of this on-package microstrip antenna are presented and discussed.

Keywords

antenna radiation patterns; ball grid arrays; ceramic packaging; finite difference time-domain analysis; microstrip antennas; modelling; transceivers; 1.9 mm; 15 mm; 5.6 GHz; 80 percent; CBGA package; ceramic CBGA package; ceramic ball grid array; compact antennas; on-package microstrip antennas; single-chip wireless transceivers; Antenna measurements; Bandwidth; Ceramics; Electronics packaging; Impedance; Integrated circuit measurements; Integrated circuit packaging; Microstrip antenna arrays; Microstrip antennas; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2002. 4th

Print_ISBN

0-7803-7435-5

Type

conf

DOI

10.1109/EPTC.2002.1185594

Filename

1185594