A 3-D stacked package solution for DDR-SDRAM applications

To meet the electronic industry´s growing demand for higher memory densities, the packaging industry has come up with solutions that allow multiple devices to be packaged within the same package footprint. These solutions are based on either die stacking or package stacking. This work discusses one such package stacking solution, called μZ™-Ball Stack package. While the focus of this paper is on the thermal performance characterization of the package, certain valuable insights on the design and electrical performance are also presented.