Silicon microsensors and microstructures

Author

Baltes, H. ; Boltshauser, T. ; Brand, O. ; Lenggenhager, R. ; Jaeggi, D.

Author_Institution

Phys. Electron. Lab., ETH Zurich, Switzerland

Volume

4

fYear

1992

fDate

3-6 May 1992

Firstpage

1820

Abstract

Microsensors and micromechanical structures realized by industrial CMOS technology with compatible postprocessing deposition or micromachining are presented. Fabrication methods are described for thermomechanical and other microsensors realized by combining silicon micromachining with industrial CMOS or bipolar IC technologies. The procedure allows inexpensive batch fabrication of thermal and mechanical microsensors with on-chip driving and signal conditioning circuitry. Examples include a capacitive moisture sensor, thermoelectric power and infrared sensors, and an acoustic transducer

Keywords

CMOS integrated circuits; electric sensing devices; elemental semiconductors; mechatronics; micromechanical devices; silicon; CMOS; Si microsensors/int; acoustic transducer; bipolar IC technologies; capacitive moisture sensor; compatible postprocessing deposition; fabrication methods; inexpensive batch fabrication; infrared sensors; mechanical microsensors; micromachining; micromechanical structures; on-chip driving; semiconductors; signal conditioning circuitry; thermoelectric power sensors; thermomechanical microsensors; CMOS technology; Fabrication; Infrared sensors; Micromachining; Micromechanical devices; Microsensors; Microstructure; Silicon; Textile industry; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0593-0

Type

conf

DOI

10.1109/ISCAS.1992.230400

Filename

230400