Title :
Silicon microsensors and microstructures
Author :
Baltes, H. ; Boltshauser, T. ; Brand, O. ; Lenggenhager, R. ; Jaeggi, D.
Author_Institution :
Phys. Electron. Lab., ETH Zurich, Switzerland
Abstract :
Microsensors and micromechanical structures realized by industrial CMOS technology with compatible postprocessing deposition or micromachining are presented. Fabrication methods are described for thermomechanical and other microsensors realized by combining silicon micromachining with industrial CMOS or bipolar IC technologies. The procedure allows inexpensive batch fabrication of thermal and mechanical microsensors with on-chip driving and signal conditioning circuitry. Examples include a capacitive moisture sensor, thermoelectric power and infrared sensors, and an acoustic transducer
Keywords :
CMOS integrated circuits; electric sensing devices; elemental semiconductors; mechatronics; micromechanical devices; silicon; CMOS; Si microsensors/int; acoustic transducer; bipolar IC technologies; capacitive moisture sensor; compatible postprocessing deposition; fabrication methods; inexpensive batch fabrication; infrared sensors; mechanical microsensors; micromachining; micromechanical structures; on-chip driving; semiconductors; signal conditioning circuitry; thermoelectric power sensors; thermomechanical microsensors; CMOS technology; Fabrication; Infrared sensors; Micromachining; Micromechanical devices; Microsensors; Microstructure; Silicon; Textile industry; Thermomechanical processes;
Conference_Titel :
Circuits and Systems, 1992. ISCAS '92. Proceedings., 1992 IEEE International Symposium on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0593-0
DOI :
10.1109/ISCAS.1992.230400
