• DocumentCode
    3277315
  • Title

    Water cooling study of natural convection heat transfer from simulated electronic chips during power-on transient period

  • Author

    Bhowmik, H. ; Tou, K.W. ; Tso, C.P.

  • Author_Institution
    Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
  • fYear
    2004
  • fDate
    9-11 Mar 2004
  • Firstpage
    130
  • Lastpage
    134
  • Abstract
    Experiments are performed using water to study the natural convection heat transfer during power-on transient period from in-line four simulated flush mounted electronic chips. The heat flux ranges from 0.1 W/cm2 to 0.6 W/cm2. The effect of heat fluxes, geometric parameters such as chip numbers are investigated. Correlations are presented for individual chips as well as for overall data in the transient regime.
  • Keywords
    forced convection; heat transfer; natural convection; thermal management (packaging); geometric parameters; heat flux; in-line four simulated flush mounted electronic chips; natural convection heat transfer; power-on transient period; simulated electronic chips; water cooling study; Electronics cooling; Heat engines; Heat transfer; Multichip modules; Production engineering; Temperature sensors; Testing; Thermal conductivity; Thermal expansion; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-8363-X
  • Type

    conf

  • DOI
    10.1109/STHERM.2004.1291314
  • Filename
    1320465
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3277315