DocumentCode
3277477
Title
Thermal effects in monolithically integrated tunable laser transmitters
Author
Kozodoy, Peter ; Strand, Tim ; Akulova, Yuliya ; Fish, Greg ; Schow, Clint ; Koh, Ping ; Bian, Zhixi ; Christofferson, James ; Shakouri, Ali
Author_Institution
Agility Commun. Inc., Santa Barbara, CA, USA
fYear
2004
fDate
9-11 Mar 2004
Firstpage
177
Lastpage
183
Abstract
We investigate thermal effects in widely-tunable laser transmitters based on an integrated single chip design. The chip contains a Sampled-Grating Distributed Bragg Reflector (SG-DBR) laser monolithically integrated with a semiconductor optical amplifier (SOA) and an electroabsorption modulator (EAM). The thermal impedance of the ridge structure is evaluated through simulation and experiment, and thermal crosstalk between sections is examined. Heating of the mirrors by neighboring sections is found to result in unintentional offsets in wavelength tuning. Thermal effects in the electroabsorption modulator are examined in depth. A positive feedback mechanism causes local temperature rise at the modulator input, with the potential to trigger catastrophic thermal runaway. A self-consistent finite-element model is developed to simulate the EAM temperature profile and device performance. This model is used to optimize the device, resulting in integrated EAMs that achieve a dissipated power limit in excess of 300 mW.
Keywords
distributed Bragg reflector lasers; electro-optical modulation; electroabsorption; finite element analysis; integrated optoelectronics; laser feedback; laser mirrors; semiconductor optical amplifiers; thermal management (packaging); Sampled-Grating Distributed Bragg Reflector; catastrophic thermal runaway; electroabsorption modulator; integrated single chip design; local temperature rise; modulator input; monolithically integrated tunable laser transmitters; positive feedback mechanism; ridge structure; self-consistent finite-element model; semiconductor optical amplifier; thermal crosstalk; thermal effects; thermal impedance; Chip scale packaging; Crosstalk; Distributed Bragg reflectors; Impedance; Laser tuning; Optical transmitters; Semiconductor lasers; Semiconductor optical amplifiers; Temperature; Tunable circuits and devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8363-X
Type
conf
DOI
10.1109/STHERM.2004.1291321
Filename
1320472
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