• DocumentCode
    3277564
  • Title

    Optimization of material thickness for THz-TDS

  • Author

    Withayachumnankul, Withawat ; Fischer, Bernd M. ; Abbott, Derek

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Univ. of Adelaide, Adelaide, SA
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    How thick should a sample be for a transmission-mode THz-TDS measurement? Should a sample be as thick as possible? The answer is dasianopsila. Although greater thickness allows T-rays to interact more with bulk material, the SNR rolls off with thickness due to signal attenuation. So, should a sample be extremely thin? Again, the answer is dasianopsila. A sample that is too thin renders itself nearly invisible to T-rays, in such a way that the system can hardly sense the difference between the sample and a free space path. Hence, where is the optimal boundary between dasiatoo thickpsila and dasiatoo thinpsila? The analytical expression to find the optimum thickness is revealed in this paper. This optimality results in the minimal uncertainty of measured optical constants. The derived model for optimal thickness is supported by the results from experiments performed with polyvinyl chloride (PVC) and other materials.
  • Keywords
    extinction coefficients; polymers; refractive index; terahertz wave spectra; time-domain analysis; PVC; THz time domain spectroscopy; THz-TDS; extinction coefficient; optical constants; optimization; polyvinyl chloride; refractive index; signal attenuation; Absorption; Extinction coefficients; Frequency; Optical attenuators; Optical refraction; Optical scattering; Optical sensors; Optical variables control; Refractive index; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared, Millimeter and Terahertz Waves, 2008. IRMMW-THz 2008. 33rd International Conference on
  • Conference_Location
    Pasadena, CA
  • Print_ISBN
    978-1-4244-2119-0
  • Electronic_ISBN
    978-1-4244-2120-6
  • Type

    conf

  • DOI
    10.1109/ICIMW.2008.4665677
  • Filename
    4665677