Title :
Integration of thermal compact models into finite element simulation of printed wiring assemblies
Author :
Haller, D. ; Neumaier, K. ; Khan, S.H. ; Grattan, K.T.V.
Author_Institution :
Fachhochschule Munchen, Munich Univ. of Appl. Sci., Germany
Abstract :
In this paper a strategy for the integration of boundary condition independent (BCI) thermal compact models in board-level static thermal finite element (FE) analyses of printed wiring assemblies (PWA) is presented. This concept is an integral part of a software development project for automatic investigation of solder joint fatigue of surface mount devices (SMT). The overall automation process comprises data capture for PWA, layout data repair and session control for finite element analysis (FEA). Solder joint fatigue results from then-no-mechanical stresses. For this reason both board- and component-level thermal simulations are needed. Among other component descriptions BCI thermal compact models can be automatically incorporated into FE models replacing detail FE modeling of IC packages. This approach has been investigated in various test examples. A further application of this approach to transient simulations seems to be possible.
Keywords :
finite element analysis; printed circuits; soldering; surface mount technology; temperature distribution; thermal management (packaging); board-level static thermal finite element analyses; data capture; finite element simulation; layout data repair; printed wiring assemblies; session control; solder joint fatigue; surface mount devices; thermal compact models integration; Assembly; Automation; Boundary conditions; Fatigue; Finite element methods; Integrated circuit modeling; Programming; Soldering; Surface-mount technology; Wiring;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
Print_ISBN :
0-7803-8363-X
DOI :
10.1109/STHERM.2004.1291334