• DocumentCode
    3277783
  • Title

    Thermal interaction of an array of flip chip components

  • Author

    Joiner, Bennett ; De Oca, Tony Montes

  • Author_Institution
    Motorola Inc., Austin, TX, USA
  • fYear
    2004
  • fDate
    9-11 Mar 2004
  • Firstpage
    286
  • Lastpage
    291
  • Abstract
    Thermal interactions for an array of FC-CBGA components were examined with both simulation and measurement. The effective thermal resistance of the component can easily double depending on the density of the surrounding components. The increase in thermal resistance is significantly greater than has been reported by other recent studies using leaded components.
  • Keywords
    cooling; flip-chip devices; heat transfer; thermal management (packaging); thermal resistance; FC-CBGA components; effective thermal resistance; flip chip components; thermal interactions; Ceramics; Computational fluid dynamics; Copper; Electrical resistance measurement; Flip chip; Packaging; Printed circuits; Temperature measurement; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-8363-X
  • Type

    conf

  • DOI
    10.1109/STHERM.2004.1291336
  • Filename
    1320487
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3277783