Simulation model development for solder joint reliability for high performance FBGA assemblies

Author

Qi, Haiyu ; Lee, Mikyoung ; Osterman, Michael ; Lee, Kyujin ; Oh, Seyong ; Schmidt, Tim

Author_Institution

CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA

fYear

2004

fDate

9-11 Mar 2004

Firstpage

300

Lastpage

307

Abstract

New construction of fine pitch plastic ball grid array (FBGA) has been investigated through experimentation and physics of failure (PoF) analysis based on the reliability point of view. In this study, a three dimensional FEA model was developed to understand the thermomechanical behavior of FBGA under cyclic thermal loading environments. Experimental measurement was also carried out and the package warpage information was recorded by high-resolution digital CCD cameras with a 3-D image correlation method to validate this FEA model. The validated FEA model was used to calculate the inelastic strain of FBGA package that is related to the fatigue life of solder joint.

Keywords

ball grid arrays; finite element analysis; semiconductor device reliability; soldering; thermal management (packaging); 3-D image correlation method; cyclic thermal loading environments; fine pitch plastic ball grid array; high performance FBGA assemblies; high-resolution digital CCD cameras; package warpage information; physics of failure analysis; simulation model development; solder joint reliability; thermomechanical behavior; three dimensional FEA model; Assembly; Charge coupled devices; Electronics packaging; Failure analysis; Field emitter arrays; Physics; Plastics; Soldering; Thermal loading; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8363-X

Type

conf

DOI

10.1109/STHERM.2004.1291338

Filename

1320489