• DocumentCode
    3278410
  • Title

    Dispersion and attenuation characteristics of Suspended Microstrip line on multilayer lossy silicon substrate at 60 GHz

  • Author

    Prasad, Manish ; Gaur, Arun Singh ; Sharma, Vivek Kr ; Pathak, Nagendra P.

  • Author_Institution
    Dept. of Electron.&Comput. Eng., Indian Inst. of Technol., Roorkee
  • fYear
    2008
  • fDate
    15-19 Sept. 2008
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper, transmission line parameters such as characteristic impedance Z0, effective dielectric constant epsiveff, attenuation constant alpha of Suspended Microstrip line on multilayer low resistivity silicon substrate are investigated. Effect of variation in the thickness of Si3N4, polyimide and metal layer are studied using HFSS. Due to suspended nature, significant reduction in transmission loss is observed in the simulation.
  • Keywords
    dispersion (wave); electric impedance; elemental semiconductors; microstrip lines; multilayers; permittivity; polymers; silicon; silicon compounds; substrates; transmission lines; HFSS; Si; Si3N4; attenuation characteristics; attenuation constant; characteristic impedance; dielectric constant; dispersion characteristics; frequency 60 GHz; high-frequency structure simulator; metal layer; microstrip line; multilayer lossy silicon substrate; multilayer low resistivity silicon substrate; polyimide layer; transmission line parameters; transmission loss; Attenuation; Conductivity; Dielectric constant; Dielectric substrates; Impedance; Microstrip; Nonhomogeneous media; Polyimides; Silicon; Transmission lines; CMOS grade Silicon; CMOS millimeter wave integrated circuits; Discontinuities; Dispersion; Equivalent Circuits; Multilayer Suspended Microstrip Line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared, Millimeter and Terahertz Waves, 2008. IRMMW-THz 2008. 33rd International Conference on
  • Conference_Location
    Pasadena, CA
  • Print_ISBN
    978-1-4244-2119-0
  • Electronic_ISBN
    978-1-4244-2120-6
  • Type

    conf

  • DOI
    10.1109/ICIMW.2008.4665716
  • Filename
    4665716