Title :
Low cost materials and processes for OE packaging
Author :
Kuen, Ong Chu ; Krishnamachari, Sudharsanam ; Ramana, Pamadighantam ; Chong, Chai Tai
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
Abstract :
This paper describes the adhesive selection process for a 10 Gbps optical transmitter package assembly. In this package, adhesives are used in a fiber and lens bonding application. The behavior of adhesives under selected reliability testing conditions is described. Five UV/visible curable adhesives for the fiber to silicon optical bench bonding were identified, based on their properties, and studied to arrive at a selection methodology. In summary, this study shows that the adhesive characteristics have a major impact in the ability of adhesives to retain the coupling during cure and service life. OE packaging with low cost materials and process has been suggested using UV/curable adhesives. The results of the study are presented in this paper.
Keywords :
adhesives; assembling; curing; integrated optoelectronics; optical fibres; optical transmitters; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; 10 Gbit/s; OE packaging; UV/visible curable adhesives; adhesive coupling; adhesive cure; adhesive reliability; adhesive selection process; fiber bonding; fiber/silicon optical bench bonding; lens bonding; low cost materials; low cost processes; optical transmitter; package assembly; Assembly; Bonding; Costs; Curing; Electronic packaging thermal management; Electronics packaging; Optical fiber devices; Optical materials; Optical transmitters; Wavelength measurement;
Conference_Titel :
Electronics Packaging Technology Conference, 2002. 4th
Print_ISBN :
0-7803-7435-5
DOI :
10.1109/EPTC.2002.1185662