An estimation method of electroplating current densities in LSI fabrication technology by inverse analysis of electric potentials in cells

Author

Kishimoto, Yoshinao ; Amaya, Kenji ; Hayabusa, Keisuke

Author_Institution

Grad. Sch. of Inf. Sci. & Eng., Tokyo Inst. of Technol., Tokyo, Japan

fYear

2009

fDate

25-28 Oct. 2009

Firstpage

53

Lastpage

56

Abstract

In this paper, we have developed a novel technique to estimate electroplating current densities from electric potentials in plating cells for LSI fabrication technology. This technique applies inverse analysis process for the estimation. We have also built a device for measuring electric potentials in the plating cell. Measurement experiments under several electroplating conditions were performed to demonstrate the validity of the proposed technique.

Keywords

current density; electric potential; electroplating; large scale integration; LSI fabrication technology; electric potentials; electroplating current density estimation; estimation method; inverse analysis process; plating cells; Copper; Current density; Electric potential; Electric variables measurement; Fabrication; Information science; Large scale integration; Materials science and technology; Polarization; Telephony;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2009 IEEE

Conference_Location

Christchurch

ISSN

1930-0395

Print_ISBN

978-1-4244-4548-6

Electronic_ISBN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2009.5398123

Filename

5398123