Title :
Attenuation in ribbon microstrip with and without dielectric cover
Author :
Joshi, K.K. ; Pollard, R.D. ; Postoyalko, V.
Author_Institution :
Dept. of Eletron. Sci., SP Coll., Pune
Abstract :
Losses in a microstrip on polyimide with finite metal thickness with and without dielectric cover has been modelled using variational analysis in the FTD and the data has been compared with the measurements on crosstalk
Keywords :
dielectric losses; integrated circuit interconnections; losses; microstrip lines; multichip modules; packaging; polymer films; variational techniques; waveguide theory; FTD; MCM-D; attenuation; conductor losses; crosstalk measurements; dielectric cover; dielectric loss; finite metal thickness; microstrip interconnects; polyimide; ribbon microstrip; variational analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564794
