Parametric studies on temperature drops in bare chip cooling system

A simple plate type heat spreader with high thermal conductivity is one of the promising heat transfer elements for bare chip cooling. However, so far as we know, the role of the spreader plate in the bare chip cooling system, which is composed of four layers (the chip, the heat spreader plate, a high heat conduction material and a compound), has not been made clear at all. In the present study, as a first step for proposing a correlation equation to estimate the maximum chip temperature T_max, parametric studies have been carried out. From a series of numerical calculations, the effects of the thickness and the thermal conductivity of the heat spreader plate, the high heat conduction material and the compound on maximum temperature drops in each layer have been clarified.