DocumentCode
3279158
Title
Fatigue analysis of out-of-plane vibration polysilicon cantilever beam under high-cycle vibration loads
Author
Chen, Long-long ; Song, Jing ; Huang, Qing-An ; Tang, Jie-ying
Author_Institution
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear
2009
fDate
25-28 Oct. 2009
Firstpage
884
Lastpage
887
Abstract
It has been proved that polysilicon film will fatigue under high cycle mechanical loads. However, there are still debates on its fatigue mechanism. In this paper, a different configuration is applied to the fatigue test to discover more phenomena. The test structure is a surface-micromachined microcantilever that vibrates out of plane under electrostatic excitation at its resonant frequency. A U-shaped notch is reaction-ion-etched at the root of the structure to induce stress concentration. Fatigue behavior is monitored by recording the shift of the resonant frequency using a laser Doppler vibrometer. Results show that the relative frequency shift reaches up to 1.3%. Compared with the reported data, the concentrated stress (about 1-10 MPa) is two orders of magnitude smaller, and the shift is two orders larger, indicating a very rapid fatigue procedure. This may be due to the greater roughness of the notch surface induced by the RIE process. The details of the mechanism are still under exploration.
Keywords
cantilevers; fatigue; fatigue testing; micromachining; microsensors; sputter etching; vibration measurement; vibrations; U-shaped notch; electrostatic excitation; fatigue analysis; high cycle mechanical loads; laser Doppler vibrometer; out-of-plane vibration; polysilicon cantilever beam; polysilicon film; reaction-ion-etching; surface-micromachined microcantilever; Electrostatics; Fatigue; Laser excitation; Monitoring; Resonant frequency; Stress; Structural beams; Testing; Vibrations; Vibrometers;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2009 IEEE
Conference_Location
Christchurch
ISSN
1930-0395
Print_ISBN
978-1-4244-4548-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2009.5398144
Filename
5398144
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