• DocumentCode
    3279274
  • Title

    Effects of buried layers doping rate on substrate noise coupling: efficiency of deep-trench techniques to improve isolation capability

  • Author

    Wane, S. ; Bajon, D. ; Baudrand, H. ; Biard, C. ; Langanay, J. ; Gamand, P.

  • Author_Institution
    ENSEEIHT, Toulouse, France
  • fYear
    2004
  • fDate
    6-8 June 2004
  • Firstpage
    179
  • Lastpage
    182
  • Abstract
    In this paper a full wave investigation of the dependence of substrate noise coupling and of deep-trench techniques efficiency on buried epitaxial layers doping rates is presented. Different grounding configurations for the buried epitaxial layers are considered to estimate the impact of spatial distribution of ground contacts on the global isolation performance between sensitive blocks. Single and double oxide deep-trenches are introduced to reduce substrate noise coupling and demonstrate significant isolation capability. Simulation results obtained using a home made simulator are successfully compared to published measurements and to commercial design tools.
  • Keywords
    buried layers; isolation technology; radiofrequency integrated circuits; semiconductor device noise; semiconductor doping; semiconductor epitaxial layers; substrates; RFIC; buried epitaxial layers; doping rates; double oxide deep trenches; full wave investigation; global isolation performance; ground contacts; grounding configurations; home made simulator; single oxide deep trenches; spatial distribution; substrate noise coupling; Circuit simulation; Conductivity; Dielectric substrates; Doping; Epitaxial layers; Grounding; Isolation technology; Noise reduction; Semiconductor device noise; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
  • ISSN
    1529-2517
  • Print_ISBN
    0-7803-8333-8
  • Type

    conf

  • DOI
    10.1109/RFIC.2004.1320563
  • Filename
    1320563