DocumentCode
3279274
Title
Effects of buried layers doping rate on substrate noise coupling: efficiency of deep-trench techniques to improve isolation capability
Author
Wane, S. ; Bajon, D. ; Baudrand, H. ; Biard, C. ; Langanay, J. ; Gamand, P.
Author_Institution
ENSEEIHT, Toulouse, France
fYear
2004
fDate
6-8 June 2004
Firstpage
179
Lastpage
182
Abstract
In this paper a full wave investigation of the dependence of substrate noise coupling and of deep-trench techniques efficiency on buried epitaxial layers doping rates is presented. Different grounding configurations for the buried epitaxial layers are considered to estimate the impact of spatial distribution of ground contacts on the global isolation performance between sensitive blocks. Single and double oxide deep-trenches are introduced to reduce substrate noise coupling and demonstrate significant isolation capability. Simulation results obtained using a home made simulator are successfully compared to published measurements and to commercial design tools.
Keywords
buried layers; isolation technology; radiofrequency integrated circuits; semiconductor device noise; semiconductor doping; semiconductor epitaxial layers; substrates; RFIC; buried epitaxial layers; doping rates; double oxide deep trenches; full wave investigation; global isolation performance; ground contacts; grounding configurations; home made simulator; single oxide deep trenches; spatial distribution; substrate noise coupling; Circuit simulation; Conductivity; Dielectric substrates; Doping; Epitaxial layers; Grounding; Isolation technology; Noise reduction; Semiconductor device noise; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
ISSN
1529-2517
Print_ISBN
0-7803-8333-8
Type
conf
DOI
10.1109/RFIC.2004.1320563
Filename
1320563
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