Fabrication of fine wiring structure by electrodeposited polyimide for high density packaging and interconnection

For packaging and interconnection of a high performance electronic system, a fine high-density wiring structure is required. We have developed a new fabrication technology of a fine wiring structure using electrodeposited polyimide and electroless plated copper. The electrochemical properties of the electrodeposition process for polyimide were investigated. A fine copper wiring structure was formed by electroless plating on a trench in an electrodeposited polyimide layer. A 2 μm wide copper wiring structure on an electrodeposited polyimide layer was successfully demonstrated. It is expected that the practical application of this new fabrication technology for high-density packaging and interconnection will be developed.