Direct liquid cooling of a stacked multichip module

Author

Chen, X.Y. ; Toh, K.C. ; Chai, J.C. ; Pinjala, D.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

fYear

2002

fDate

10-12 Dec. 2002

Firstpage

380

Lastpage

384

Abstract

With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and the conjugated convection-conduction heat transfer in the cooling structure. The effects of the top clearance, the side clearance, flow rate, heating arrangement on the maximum chip temperature and velocity distribution are presented.

Keywords

convection; cooling; heat conduction; multichip modules; numerical analysis; temperature distribution; thermal management (packaging); 3D numerical simulation; FC-77; conjugated convection-conduction heat transfer; cooling structure; direct liquid cooling; flow rate; heating arrangement; maximum chip temperature distribution; side clearance; single-phase liquid cooling; stacked MCM; stacked multichip module; top clearance; velocity distribution; Electronic components; Electronics cooling; Heat transfer; High performance computing; Immersion cooling; Indirect liquid cooling; Liquid cooling; Microchannel; Multichip modules; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2002. 4th

Print_ISBN

0-7803-7435-5

Type

conf

DOI

10.1109/EPTC.2002.1185702

Filename

1185702