Title :
A very low cost, 3-axis, MEMS accelerometer for consumer applications
Author :
Hollocher, D. ; Zhang, X. ; Sparks, A. ; Bart, S. ; Sawyer, W. ; Narayanasamy, P. ; Pipitone, C. ; Memishian, J. ; Samuels, H. ; Ng, S.-L. ; Mhatre, R. ; Whitley, D. ; Sammoura, F. ; Bhagavat, M. ; Tsau, C. ; Nunan, K. ; Judy, M. ; Farrington, M. ; Yang,
Author_Institution :
Micromachined Products Div., Analog Devices, Inc., Cambridge, MA, USA
Abstract :
We report here on a novel 3-axis MEMS accelerometer intended to meet the requirements of a high volume, very low cost sensor in consumer gaming and hand-held applications. In order to balance the performance and cost requirements of such applications, this device achieves 3-axis sensing with a single proof-mass. This accomplishment required significant process, device, and test design novelty. Because of the extreme cost constraints in these markets, this design reexamines the core system trade-offs between single-chip integrated and 2-chip MEMS solutions. A 2-chip solution was chosen in this case. Minimizing package costs lead to the use of chip stacking in an over-molded plastic package. Finally, a sophisticated method of probing the sensor-only die was developed, which allowed the further development of a ¿no-shake¿ sensitivity trim algorithm which does not require mechanical stimulation of the device. Based on the design methodologies described here, a very low cost sensor with superior performance was achieved. The acceleration sensitivity achieved is 300 mV/g with a noise limited resolution of 150 ¿g/¿(Hz). The offset voltage temperature coefficient is less than 0.3 mV/degC.
Keywords :
acceleration measurement; accelerometers; microsensors; plastic packaging; 2-chip MEMS solution; chip stacking; consumer applications; handheld applications; low-cost 3-axis MEMS accelerometer; no-shake sensitivity trim algorithm; noise limited resolution; offset voltage temperature coefficient; package cost minimization; plastic package; sensor-only die; Acceleration; Accelerometers; Costs; Design methodology; Mechanical sensors; Micromechanical devices; Plastic packaging; Sensor phenomena and characterization; Stacking; Testing;
Conference_Titel :
Sensors, 2009 IEEE
Conference_Location :
Christchurch
Print_ISBN :
978-1-4244-4548-6
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2009.5398189