Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package

Author

Jones, Robert E. ; Ramiah, Chandra ; Kamgaing, Telesphor ; Banerjee, Suman K. ; Tsai, Chi-Taou ; Hughes, Henry ; De Silva, Ananda ; Drye, Jim ; Vaughan, Cliff ; Miglore, Roger ; Penunuri, David ; Lucero, Rudy ; Frear, Darrel R. ; Miller, Mel

Author_Institution

Motorola Inc., Austin, TX, USA

fYear

2004

fDate

6-8 June 2004

Firstpage

307

Lastpage

310

Abstract

Enhanced integration of mobile phone components is driven by demands for reduced form factor and cost. Because SAW filters must be fabricated on piezoelectric substrates, they are difficult to monolithically integrate on semiconductor chips. Here we report on the integration of a compact wafer-scale packaged SAW filter stacked over a transceiver chip in a quad flat-pack no-lead (QFN) package. An integrated passive device interposer provided redistribution and matching. We demonstrated the successful integration of both EGSM and DCS filters in such modules. SAW compact models based on the coupling of modes model were developed to facilitate system design.

Keywords

BiCMOS integrated circuits; cellular radio; coupled mode analysis; integrated circuit packaging; multichip modules; plastic packaging; surface acoustic wave filters; transceivers; wafer-scale integration; BiCMOS transceiver chip; DCS filters; EGSM filters; QFN package; RF receiver filter; SAW filter integration; coupled mode model; digital cellular systems; extended GSM; mobile phone components; multi-chip modules; package height; package scaling; passive device interposer; plastic package; quad flat-pack no-lead package; semiconductor device packaging; stacked SAW filter; surface acoustic wave filters; wafer-scale SAW filter; Costs; Distributed control; Mobile handsets; Radio frequency; SAW filters; Semiconductor device modeling; Semiconductor device packaging; Substrates; Surface acoustic waves; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE

ISSN

1529-2517

Print_ISBN

0-7803-8333-8

Type

conf

DOI

10.1109/RFIC.2004.1320604

Filename

1320604