Title :
Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation
Author :
Yue Zhang ; Li Zheng ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Embedded microfluidic cooling is considered a promising solution for heat removal in 3D ICs. This paper presents tier-independent microfluidic cooling in a 2-tier chip thermal testbed. Each tier has 4 segmented heaters emulating a simplified multicore processor. Tier-independent cooling is shown to reduce the pumping power by 37.5% by preventing over-cooling when an operating temperature is specified. Thermal coupling for 3D chips with liquid cooling is also discussed.
Keywords :
cooling; microfluidics; thermal management (packaging); three-dimensional integrated circuits; 2-tier chip thermal testbed; embedded microfluidic cooling; heat removal; heterogeneous 3D ICs; liquid cooling; nonuniform power dissipation; pumping power reduction; thermal coupling; tier-independent microfluidic cooling; Coolants; Heat sinks; Heating; Junctions; Microfluidics; Three-dimensional displays;
Conference_Titel :
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0438-9
DOI :
10.1109/IITC.2013.6615561
