Title :
Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications
Author :
Ruoh-Ning Tzeng ; Yan-Pin Huang ; Yu-San Chien ; Ching-Te Chuang ; Wei Hwang ; Jin-Chern Chiou ; Ming-Shaw Shy ; Teu-Hua Lin ; Kou-Hua Chen ; Chi-Tsung Chiu ; Ho-Ming Tong ; Kuan-Neng Chen
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.
Keywords :
copper alloys; indium alloys; integrated circuit bonding; integrated circuit interconnections; solders; tin alloys; In-Cu; In-Cu interconnects; Sn; Sn interconnects; composite solder; excellent electrical performance; intermetallic compounds; low temperature bonding technology; multiple current stressing; three-dimensional integration; Atomic layer deposition; Bonding; Diffraction; Reliability; Temperature; Temperature measurement; Tin;
Conference_Titel :
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0438-9
DOI :
10.1109/IITC.2013.6615572
