Title :
Annealing effect on the structure characteristics of nano-scale damascene copper lines
Author :
Konkova, T. ; Mironov, Sergey ; Ke, Y. ; Onuki, J.
Author_Institution :
Dept. of Mater. Sci. & Eng., Ibaraki Univ., Hitachi, Japan
Abstract :
High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process.
Keywords :
annealing; copper; electrodeposition; electron diffraction; grain growth; nanoparticles; reliability; Cu; EBSD maps; annealing; electrodeposition process; grain growth; grain structure; grain texture; high-resolution electron backscatter diffraction; nanoscale damascene copper lines; pinning effect; reliability; second-phase particles; temperature 200 degC to 500 degC; Annealing; Copper; Educational institutions; Grain boundaries; Microstructure; Thermal stability;
Conference_Titel :
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0438-9
DOI :
10.1109/IITC.2013.6615574
