DocumentCode :
3280681
Title :
Epoxy-based permeable membrane fabrication for 3D microfluidic device
Author :
Hirai, Yoshikazu ; Nakai, Yusuke ; Makino, Yoshihide ; Sugano, Koji ; Tsuchiya, Toshiyuki ; Tabata, Osamu
Author_Institution :
Dept. of Micro Eng., Kyoto Univ., Kyoto, Japan
fYear :
2011
fDate :
20-23 Feb. 2011
Firstpage :
184
Lastpage :
187
Abstract :
We report for the first time on a simple fabrication via UV photolithography for a free-standing filtration membrane made of epoxy-based photoresist and its integration on a multilevel microfluidic device. The fabrication process involves three-dimensional thick-photoresist microstructuring combined with standard negative photoresist processing. In this paper, a primary feature of membrane permeability dependence on fabrication process parameters was characterized by employing a cross-linking reaction model. The experiments using a multilevel microfluidic device demonstrated the proposed fabrication is capable of fabricating nano-filtration membrane while maintaining a sufficient mechanical strength for applications in polymer-based microfluidic devices.
Keywords :
mechanical strength; membranes; microfabrication; microfiltration; microfluidics; nanofabrication; nanofiltration; permeability; photoresists; polymers; ultraviolet lithography; 3D multilevel microfluidic device; UV photolithography; cross-linking reaction model; epoxy-based permeable membrane fabrication; epoxy-based photoresist; free-standing filtration membrane; mechanical strength; nano-filtration membrane; polymer-based microfluidic device; standard negative photoresist processing; three-dimensional thick-photoresist microstructure; Biomembranes; Fabrication; Filtration; Lithography; Microfluidics; Resists; Three dimensional displays; UV lithography; chemically amplified resist; cross-linking reaction; filteration membrane; microfluidics; photoresist; three-dimensional microfabrication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-61284-775-7
Type :
conf
DOI :
10.1109/NEMS.2011.6017325
Filename :
6017325
Link To Document :
بازگشت