Title :
Improved InGaP/GaAs HBTs AC performance and linearity with collector design
Author :
Wang, Che-Ming ; Hsu, Hung-Tsao ; Shu, Hsiu-Chuan ; Liu, Yu-An ; Hsin, Yue-Ming
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Chung-li, Taiwan
Abstract :
An additional thin high-doping layer within the collector of InGaP/GaAs HBTs has been designed and fabricated to improve the Kirk effect threshold current, cutoff frequency, and power distortion, while keeping a high breakdown voltage. The proposed structure effectively relieves the Kirk effect and results in a higher current drive and cut-off frequency. From the extracted CBC with VCB, HBTs with non-uniform collector doping demonstrate less base-collector capacitance variation than that in baseline HBTs, due to the depletion region limited by the thin, high-doping layer. The experimental results on third-order intermodulation demonstrate a significant improvement in OIP3 by as large as 6 dB. This proposed InGaP/GaAs HBT, with non-uniform collector doping, is well suited to replace current InGaP/GaAs HBTs for power amplifier applications, due to its significantly improved linearity and current/frequency capability, with negligible impact on DC characteristics and fabrication.
Keywords :
III-V semiconductors; doping profiles; gallium compounds; heterojunction bipolar transistors; indium compounds; intermodulation; power amplifiers; power bipolar transistors; semiconductor device breakdown; HBT AC performance; HBT linearity; InGaP-GaAs; Kirk effect threshold current; OIP3; base-collector capacitance variation; collector thin high-doping layer; cutoff frequency; high breakdown voltage; nonuniform collector doping; power amplifier applications; power distortion; third-order intermodulation; Capacitance; Cutoff frequency; Doping; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Kirk field collapse effect; Linearity; Power amplifiers; Threshold current;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2004. Digest of Papers. 2004 IEEE
Print_ISBN :
0-7803-8333-8
DOI :
10.1109/RFIC.2004.1320631