Design, fabrication and actuation of 4-axis thermal actuating image stabilizer

Author

Lin, Chun-Ying ; Tsai, Tsung-Ying ; Chiou, Jin-Chen ; Chien, Chin-Ping

Author_Institution

Inst. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

fYear

2011

fDate

20-23 Feb. 2011

Firstpage

192

Lastpage

196

Abstract

This work presents a MEMS-based (micro-electro-mechanical system) thermal actuating image stabilizer. The proposed stage is designed as a 4-axis decoupling XY stage and 1.49 × 1.49 × 0.4 mm³ in size. This stabilizer is fabricated by Silicon on Isolator (SOI) process, including inductively coupled plasma (ICP) process and flip-chip bonding technique. The maximum actuating distance of the stage is 25 μm which is sufficient to resolve the anti-shaking problem in 3X optical zoom condition of a three mega pixels image sensor. According to the simulation of CoventorWare, the supplied voltage for the 25 μm moving distance is lower than 20 volts.

Keywords

flip-chip devices; image sensors; microsensors; silicon-on-insulator; 4-axis thermal actuating image stabilizer; MEMS-based thermal actuating image stabilizer; antishaking problem; flip-chip bonding; image sensor; inductively coupled plasma process; micro-electro-mechanical system; silicon on isolator process; Actuators; Fabrication; Heating; Iterative closest point algorithm; Micromechanical devices; Springs; Thermal stability; MEMS; XY stage; thermal actuator;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on

Conference_Location

Kaohsiung

Print_ISBN

978-1-61284-775-7

Type

conf

DOI

10.1109/NEMS.2011.6017327

Filename

6017327