Title :
Interconnection requirements and multi-die integration for FPGAs
Author :
Rahman, Aminur ; Schulz, J. ; Grenier, R. ; Chanda, Kaushik ; Lee, M.J. ; Ratakonda, D. ; Shi, Hongyu ; Li, Zuyi ; Chandrasekar, Karthik ; Xie, Junfeng ; Ibbotson, D.
Author_Institution :
Altera Corp., San Jose, CA, USA
Abstract :
Die stacking technology with high-density interconnect is enabling new product architectures and capabilities. Silicon interposer based stacking with through silicon via (TSV) has gained traction for high-performance applications. Some of the challenges in manufacturing technology, supply-chain strategy, design tools and infrastructure are being addressed to enable broader technology adoption. This paper provides an overview of Field Programmable Gate Array (FPGA) application trends which are driving the need for advanced die-stacking technologies. We present design and manufacturing considerations for stacking technologies and highlight lessons learned from a recent technology demonstration vehicle.
Keywords :
field programmable gate arrays; integrated circuit interconnections; three-dimensional integrated circuits; FPGA; die stacking technology; field programmable gate array application; high density interconnect; interconnection requirements; multidie integration; silicon interposer based stacking; through silicon via; Bandwidth; Field programmable gate arrays; Manufacturing; Silicon; Three-dimensional displays; Through-silicon vias; Vehicles;
Conference_Titel :
Interconnect Technology Conference (IITC), 2013 IEEE International
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0438-9
DOI :
10.1109/IITC.2013.6615596
