DocumentCode
328145
Title
Packaging of high speed DFB laser diodes
Author
Lindgren, Stefan ; Åhlfeldt, Henrik ; Kerzar, Boris ; Kjebon, Olle
Author_Institution
Ind. Microelectron. Center, Kista, Sweden
Volume
1
fYear
1996
fDate
19-19 Sept. 1996
Firstpage
97
Abstract
Today laser diodes can be modulated at high frequencies where parasitics from bond wires, carriers, and housings can deteriorate the laser performance. As a remedy the lasers can be mounted very close to high frequency connectors or alternatively on carefully designed carriers with integrated functions. Flip-chip mounting is especially attractive since it eliminates bond wires, is optimal for heat sinking and it enables passive alignment to optical fibres.
Keywords
distributed feedback lasers; flip-chip devices; high-speed optical techniques; optical fibre couplers; optical transmitters; optical workshop techniques; semiconductor device packaging; semiconductor lasers; bond wires; carefully designed carriers; carriers; flip-chip mounting; heat sinking; high frequencies; high frequency connectors; high speed DFB laser diode packaging; housings; integrated functions; laser performance; optical fibre alignment; optimal; parasitics; passive alignment;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Communication, 1996. ECOC '96. 22nd European Conference on
Conference_Location
Oslo, Norway
Print_ISBN
82-423-0418-1
Type
conf
Filename
713749
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