Integration of triple-band GSM antenna switch module using SOI CMOS

An integrated triple-band GSM antenna switch module, fabricated in RF CMOS on a sapphire substrate, is presented in this paper. The low cost and compact size requirements in wireless and mobile communication systems motivate the continuing integration of the analog portions of the design. The antenna switch die incorporates a FET switch, transmit path filters, and all bias and control circuitry on the same substrate using a 0.5 μm CMOS process. A revised version of the die is also proposed, which makes use of an additional copper interconnect layer to reduce die area.