Title :
Signal integrity analysis of simultaneous switching noises and decoupling capacitors in digital packages and PCB systems
Author_Institution :
Quad Design Technol., Camarillo, CA
Abstract :
Simultaneous switching noises (SSN) and crosstalk in complex interconnects and power/ground structures have increasingly become the limiting factors in the signal integrity and design of high speed digital systems. In this paper, an integrated approach is developed for system signal integrity and ground bounce simulation, with emphasis on plane modeling, simultaneous switching noises in power/ground distribution networks and the effectiveness of decoupling capacitors in solving SSN problem
Keywords :
capacitors; circuit noise; packaging; printed circuits; PCB; crosstalk; decoupling capacitor; ground bounce; high speed digital system; interconnect; package; plane model; power/ground distribution network; signal integrity; simulation; simultaneous switching noise;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564807
