• DocumentCode
    3281757
  • Title

    Fabrication and testing of a novel silicon probe for micromachined surface profilers

  • Author

    Jiang, Senlin ; Zhang, Dacheng ; Lin, Longtao ; Yang, Zhenchuan ; Yan, Guizhen

  • Author_Institution
    Dept. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    406
  • Lastpage
    409
  • Abstract
    In this paper, we present the fabrication and testing of a novel probe for micromechanical surface profiler with double-ended tuning forks (DETFs) resonator as the displacement-sensing element. The probe is fabricated through the standard silicon-on-glass process developed by Peking University. The frequency variation of the DETF caused by the induced axial stress is directly proportional to the input displacement. Two stages micro-leverage mechanisms are introduced for force amplification to increase the overall sensitivity. The experimental results indicate the device has a nominal resonant frequency of 54.5 kHz under atmosphere at room temperature and the overall sensitivity is approximately 359.7 Hz/μm, which shows a good agreement with the simulation value of 330 Hz/μm using ANSYS™. Furthermore, the testing results depict the variation of frequency is linear to the displacement load within the range of 10μm.
  • Keywords
    displacement measurement; elemental semiconductors; glass; micromachining; micromechanical resonators; microsensors; silicon; vibrations; DETF resonator; axial stress; displacement-sensing element; double-ended tuning forks resonator; force amplification; frequency 54.5 kHz; frequency variation; microfabrication; microleverage mechanism; micromachined surface profiler; micromechanical surface profiler; resonant frequency; silicon-on-glass process; temperature 293 K to 298 K; Fabrication; Force; Optical resonators; Probes; Resonant frequency; Silicon; Testing; Displacement measurement; Double-ended-tuning-forks (DETFs) resonator; Microleverage; Silicon-Glass; bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017378
  • Filename
    6017378