A technique for deriving the equivalent circuit of an SOP package using the FDTD in conjunction with TOUCHSTONE

Summary form only given. The development of equivalent circuits for modeling the full wave response of high-speed digital circuits is of great practical interest, but the main methodology for obtaining the equivalent circuits often involves quasistatic analysis which is not accurate at the higher frequencies. In this presentation, the finite difference time domain (FDTD) technique is employed to model the electrical characteristics of an electronic package. This technique is a general-purpose Maxwell solver which is capable of modeling the complex package structure and computing the frequency response over a band of frequencies in one computer simulation. With the level of computer technology available today and extensive research that is leading to more accurate modeling with the FDTD and related time-domain methods, this approach is becoming a viable means of analyzing detailed electronic packages and other problems. In this work, we will demonstrate a method for developing equivalent circuits of a generic silicon on plastic (SOP) package which involves the full wave solver FDTD, in conjunction with the commercially available software TOUCHSTONE and a pole-zero characterization algorithm developed at the University of Illinois. The discretized package model used in the FDTD analysis includes many details such as the pads, bond wires, silicon chip, internal metal patch beneath the silicon, plastic mold enclosing the package and the circuit board to which the package is mounted