• DocumentCode
    3282291
  • Title

    Micro-machined resonant accelerometer with high sensitivity

  • Author

    Wang, Junbo ; Shang, Yanlong ; Tu, Sheng ; Liu, Lei ; Chen, Deyong

  • Author_Institution
    State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Beijing, China
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    527
  • Lastpage
    530
  • Abstract
    A resonant accelerometer with high sensitivity, fabricated through MEMS bulk-silicon processes, is proposed in this paper. The external acceleration can be transferred into the frequency shift of the resonant beams which is double-clamped by the proof mass and the anchor. To improve the sensitivity of the accelerometer, a micro leverage force amplifying mechanism is adopted, from which the transformation efficiency between the external acceleration and the axial stress of the resonant beam would be improved obviously. MEMS bulk-silicon processes were used on single one wafer to fabricate the sensor chip. The electromagnetic excitation and detection was used to make the closed-loop control of the sensor easier. Experimental results show that the Q-factor of the resonant beam is about 450 and the sensitivity of the accelerometer is about 1900 Hz/g.
  • Keywords
    Q-factor; accelerometers; closed loop systems; elemental semiconductors; micromechanical devices; silicon; MEMS bulk-silicon processes; Q-factor; Si; axial stress; closed-loop control; electromagnetic detection; electromagnetic excitation; frequency shift; high sensitivity; microleverage force amplifying mechanism; micromachined resonant accelerometer; resonant beams; sensor chip; Acceleration; Accelerometers; Electrodes; Particle beams; Sensitivity; Silicon; Stress; High Q-factor; High Sensitivity; MEMS; Resonant Accelerometer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017409
  • Filename
    6017409