• DocumentCode
    3282994
  • Title

    Investigation of electromigration in micrometer-scale metal wires by in-situ optical microscopy

  • Author

    Kuwabara, Yosuke ; Nishimura, Shinya ; Zaharuddin, Rizal ; Shirakashi, Jun-ichi

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Tokyo Univ. of Agric. & Technol., Tokyo, Japan
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    681
  • Lastpage
    684
  • Abstract
    Electromigration-induced gap formation of μm-scale Au wires was investigated by in-situ optical microscopy. The crack growth and gap formation occurred rapidly with increasing the average power dissipated in the wires during electromigration (EM). We visualized the thermal distribution of passivated Au wires during EM. Heating process of the wires was clearly observed through the color variation of the passivation film due to Joule heating. In particular, slow gap formation and gradual color transition were clearly observed under feedback-controlled EM (FCE) procedure. The color transition area was proportional to the average power during EM. Moreover, in-situ imaging of heating in 300-μm-scale graphite and 30-μm-scale W wires was also studied using near-infrared (NIR) microscopy with a low-cost, standard charge coupled device (CCD) detector. In-situ observations based on optical microscopy are useful methods for the investigation of EM in μm-scale metal wires.
  • Keywords
    charge-coupled devices; electromigration; gold; micro-optics; optical microscopy; wires; Au; Joule heating; charge coupled device detector; crack growth; electromigration-induced gap formation; micrometer-scale metal wires; near-infrared microscopy; optical microscopy; thermal distribution; Films; Gold; Image color analysis; Optical microscopy; Scanning electron microscopy; Wires; electromigration; in-situ observation; nanogap; optical microscopy; thermal distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017446
  • Filename
    6017446