Title :
Impurity Induced Voiding in Copper Interconnects
Author :
Kovler, M. ; Buchbinder, M. ; Cohen, H. ; Rabkin, E. ; Estrin, Y.
Keywords :
Adhesives; Annealing; Atomic measurements; Copper; Current density; Grain boundaries; Impurities; Tensile stress; Testing; Voltage;
Conference_Titel :
Semiconductor Device Research Symposium, 2005 International
Print_ISBN :
1-4244-0083-X
DOI :
10.1109/ISDRS.2005.1596002
