• DocumentCode
    3283428
  • Title

    Numerical analysis of impact of imprinting pressure on profile shape and mold deformation in UV-NIL

  • Author

    Du, Jun ; Wei, Zhengying ; He, Wei ; Tang, Yiping

  • Author_Institution
    State Key Lab. of Manuf. Syst. Eng., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    792
  • Lastpage
    795
  • Abstract
    In this paper, in order to reveal the interrelationship among the imprinting pressure, the evolution profile and the mold deformation, a novel numerical model accounted for surface tension and contact angle was established to simulate the resist filling process and mold deformation by using computational fluid dynamics (CFD). As a basic study to understand the resist filling characteristics in UV-NIL, we had chosen a simple rectangular cavity as a computational domain. In order to fully account for the effect of imprinting pressure, numerical simulations have been performed for different imprinting pressure. The evolution profile of the resist and mold deformation was found to be significantly influenced by the imprinting pressure. Numerical results show that a higher imprinting pressure will make the profile shape of resist more flat, which can improve the filling rate of the resist and reduce the filling time. However, too high imprinting pressure is easy to cause larger mold deformation that is unfavorable to the demoulding process and finial quality of imprinted pattern. Through a synthetic consideration of the influence of the imprinting pressure on the evolution profile and the mold deformation, we considered that the optimum imprinting pressure should be about 0.1MPa.
  • Keywords
    computational fluid dynamics; contact angle; nanolithography; surface tension; ultraviolet lithography; CFD; UV-NIL; computational fluid dynamics; contact angle; evolution profile; imprinting pressure; mold deformation; nanoimprint lithography; profile shape; rectangular cavity; resist filling process; surface tension; Cavity resonators; Filling; Resists; Strain; Stress; Substrates; Viscosity; UV-NIL; imprinting pressure; mold deformation; profile shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017473
  • Filename
    6017473