Development of transparent biochip platform for patch clamp technology

In this study, we present a novel three-level pillars silicon master to fabricate the transparent polydimethylsiloxane (PDMS) biochip with 1 ¿m aperture. The three-level pillars silicon master was manufactured by photolithography and ICP etching processes. Especially, we use the IR (image reversal) mode to fabricate the third pillar in silicon master for increasing the successful rate. Due to the three-level pillars design, the needle-breaking rate was decreased. Through the array of three-level pillars silicon master, we can manufacture the transparent PDMS chip with mass production and high through-put system. After integrating with the microfluidic system and patch-clamping equipment, the chip capacitance was measured and analyzed with 10 mV voltage pulse. The chip capacitance is 1.6 ± 0.5 pF and open resistance is 2.39 ± 0.6 M¿.