The characteristics of glass deep dry etching process with a single PR mask

The processes of fabricating the etch mask for a glass dry etching are complicated and require high cost. To reduce these disadvantages, we suggest a novel glass dry etching method using a single photoresist mask. In this work, we figured out the optimized condition for the glass dry etching using a photoresist without any metal or silicon mask. We observed the characteristics of quartz wafer, such as the etch profile, etch rate, the selectivity and the critical dimension loss rate.