DocumentCode
3284198
Title
Low Leakage Current Transport and High Breakdown Strength of HfO2/SiC MIS Device Structures
Author
Hullavarad, S.S. ; Jones, E.B. ; Vispute, R.D. ; Venkatesan, T.
fYear
2005
fDate
Dec. 7-9, 2005
Firstpage
238
Lastpage
239
Keywords
Dielectric constant; Dielectric materials; Electric breakdown; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Leakage current; MIS devices; Silicon carbide; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2005 International
Print_ISBN
1-4244-0083-X
Type
conf
DOI
10.1109/ISDRS.2005.1596072
Filename
1596072
Link To Document