DocumentCode
3284794
Title
Deterministic three-dimensional micro-assembly in parallel
Author
Lin, Huo-Chuan ; Wang, Chia-Chung ; Wang, Kerwin
Author_Institution
Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan
fYear
2011
fDate
20-23 Feb. 2011
Firstpage
1128
Lastpage
1131
Abstract
This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies.
Keywords
adhesion; batch processing (industrial); force measurement; microassembling; batch processes; deterministic three dimensional microassembly method; microparts; noncontact measurement method; parallel assembly system design; surface adhesion force measurement; Adhesives; Assembly; Force; Indexes; Receivers; Self-assembly; Substrates; deterministic-assembly; micro-assembly; self-assembly; three-dimensional assembly;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
Conference_Location
Kaohsiung
Print_ISBN
978-1-61284-775-7
Type
conf
DOI
10.1109/NEMS.2011.6017555
Filename
6017555
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