• DocumentCode
    3284794
  • Title

    Deterministic three-dimensional micro-assembly in parallel

  • Author

    Lin, Huo-Chuan ; Wang, Chia-Chung ; Wang, Kerwin

  • Author_Institution
    Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    1128
  • Lastpage
    1131
  • Abstract
    This paper introduces a novel deterministic three-dimensional micro-assembly method to tackle the difficulty of micro-part assembling at unstable equilibrium region. We design, characterize and manufacture an parallel assembly system, which is capable of connecting micro-parts from almost arbitrary direction into desired structures in batch processes. This paper also introduces a non-contact method to measurement the surface adhesion forces among parts, donor and receiver substrates. Five successive 3D micro-assembly processes have be tested with yield ratio investigation to demonstrate this technology. Table 1. A comparison of this study to some published three-dimensional assembly technologies.
  • Keywords
    adhesion; batch processing (industrial); force measurement; microassembling; batch processes; deterministic three dimensional microassembly method; microparts; noncontact measurement method; parallel assembly system design; surface adhesion force measurement; Adhesives; Assembly; Force; Indexes; Receivers; Self-assembly; Substrates; deterministic-assembly; micro-assembly; self-assembly; three-dimensional assembly;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017555
  • Filename
    6017555