DocumentCode
3284980
Title
Accurate, high speed modeling of integrated passive devices in multichip modules
Author
Poddar, Raju ; Brooke, M.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
184
Lastpage
186
Abstract
A new method for the predictive modeling of passive devices with interactions based upon measurement and primitive cell characterization is presented. Building block RLC equivalents can be utilized for arbitrary geometry device modeling in high speed circuit simulators
Keywords
circuit analysis computing; equivalent circuits; integrated circuit modelling; multichip modules; MCM; arbitrary geometry device modeling; building block RLC equivalents; high speed circuit simulators; high speed modeling; integrated passive devices; multichip modules; passive devices; predictive modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564825
Filename
564825
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