DocumentCode
328514
Title
Standardised packaging and interconnection for inter and intra-board optical communication (SPIBOC)
Author
Cannell, G.J.
Author_Institution
Nortel Technol., Harlow, UK
Volume
3
fYear
1996
fDate
19-19 Sept. 1996
Firstpage
249
Abstract
The European ESPRIT III SPIBOC project has developed a small set of cost-effective modules and interconnect media for building very high performance optical links. These links will support 12 channels at up to 2.5 Gbit/s per channel.
Keywords
integrated circuit packaging; integrated optoelectronics; modules; optical fibre communication; optical interconnections; research initiatives; standardisation; 2.5 Gbit/s; European ESPRIT III SPIBOC project; Gbit/s per channel; cost-effective modules; inter-board optical communication; interconnect media; intra-board optical communication; optical interconnections; standardised packaging; very high performance optical links;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Communication, 1996. ECOC '96. 22nd European Conference on
Conference_Location
Oslo, Norway
Print_ISBN
82-423-0418-1
Type
conf
Filename
715659
Link To Document