DocumentCode
3285259
Title
High-Frequency Modeling of Quad Flat No-Lead Packages
Author
Lai, Yeong-Lin ; Ho, Cheng-Yu
fYear
2005
fDate
Dec. 7-9, 2005
Firstpage
378
Lastpage
379
Keywords
Bonding; Chip scale packaging; Frequency measurement; Gold; Integrated circuit packaging; Lead; Mechatronics; Semiconductor device packaging; Systems engineering education; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2005 International
Print_ISBN
1-4244-0083-X
Type
conf
DOI
10.1109/ISDRS.2005.1596144
Filename
1596144
Link To Document