DocumentCode :
3285259
Title :
High-Frequency Modeling of Quad Flat No-Lead Packages
Author :
Lai, Yeong-Lin ; Ho, Cheng-Yu
fYear :
2005
fDate :
Dec. 7-9, 2005
Firstpage :
378
Lastpage :
379
Keywords :
Bonding; Chip scale packaging; Frequency measurement; Gold; Integrated circuit packaging; Lead; Mechatronics; Semiconductor device packaging; Systems engineering education; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2005 International
Print_ISBN :
1-4244-0083-X
Type :
conf
DOI :
10.1109/ISDRS.2005.1596144
Filename :
1596144
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3285259
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