Application of electro-thermal simulation and non-invasive in-situ waveform probing techniques to GSM PA optimization

Author

Wei, C.-J. ; Gering, Joseph ; Gerard, Maze ; Sprinkle, S. ; Hu, Jiankun ; Dai, P. ; Burton, R. ; Tkachenko, Y.

Author_Institution

Skyworks Solutions. Inc., Woburn, MA

fYear

2003

fDate

15-17 Oct. 2003

Firstpage

12

Lastpage

13

Abstract

The application of electro-thermal coupling simulation and high impedance dynamic loadline probing to the understanding and optimization of a GSM power amplifier (PA) is described. Electro-thermal simulation explains the temperature imbalance across the output HBT PA stage, which may lead to thermal collapse and amplifier damage. Direct probing of the voltage and current waveforms at different locations on the output combiner confirms the electro-thermal imbalance in the output PA HBT array. Results of the modified PA module are presented showing significant improvements in RF performance and ruggedness.

Keywords

bipolar transistor circuits; circuit optimisation; circuit simulation; mobile handsets; power amplifiers; thermal analysis; GSM PA optimization; GSM power amplifier; HBT; amplifier damage; electro-thermal simulation; high impedance dynamic loadline probing; output combiner; temperature imbalance; thermal collapse; waveform probing techniques; Feeds; GSM; Heterojunction bipolar transistors; Infrared imaging; Power amplifiers; Radio frequency; Temperature; Thermal loading; Thermal resistance; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless Communication Technology, 2003. IEEE Topical Conference on

Print_ISBN

0-7803-8196-3

Type

conf

DOI

10.1109/WCT.2003.1321421

Filename

1321421