DocumentCode
3285371
Title
Carbon nano partitions for heat dissipation
Author
Kuo, Leon C J ; Tsai, Jeff T H
Author_Institution
Grad. Inst. of Electro-Opt. Eng., Tatung Univ., Taipei, Taiwan
fYear
2011
fDate
20-23 Feb. 2011
Firstpage
1258
Lastpage
1261
Abstract
We fabricated carbon nano-partitions (CNPs) which vertically standing on the metal substrates by radio-frequency magnetron sputtering for dissipating heat applications. Considerable enhancement of the conductive heat transfer has been confirmed and the enhancement depends on the spacing density of nano partitions. The optimum nano-porous density could enhanced the heat transfer when the lower density CNP was made. In our experiments, the enhancement is basically according to the system thermal resistance and it can be reduced by 7.8% to 16.8% which compared with the control samples. Besides, we also make a trial on LEDs. The light output of different colored LEDs responds differently to temperature changes. For the most sensitive color, amber, we can diminish the decrease of light output power by about 15% and the dominant wavelengths shift by about 2nm less than the one is not coated on CNPs.
Keywords
carbon; heat transfer; light emitting diodes; nanoporous materials; sputtering; thermal resistance; carbon nanopartition; colored LED; conductive heat transfer; dominant wavelength shift; heat dissipation; metal substrate; optimum nanoporous density; radiofrequency magnetron sputtering; spacing density; system thermal resistance; Carbon; Heating; Light emitting diodes; Substrates; Temperature sensors; Thermal resistance; LEDs; carbon nano flakes; heat dissipation; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
Conference_Location
Kaohsiung
Print_ISBN
978-1-61284-775-7
Type
conf
DOI
10.1109/NEMS.2011.6017586
Filename
6017586
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