Title :
Microwave device and circuit challenges for next generation wireless applications
Author :
Larson, Lawrence E.
Author_Institution :
Centerfor Wireless Commun., Univ. of California San Diego, La Jolla, CA, USA
Abstract :
The rapid deployment of next generation communications systems - both wired and wireless on a world-wide basis creates a unique opportunity for the semiconductor industry. High-speed networks require massive computing power and analog and radiofrequency devices with wide dynamic range and bandwidth. The semiconductor technologies required to implement these systems are highlighted, with particular emphasis on the technologies required to meet the demands of mobile computing applications.
Keywords :
3G mobile communication; cellular radio; microwave integrated circuits; mobile computing; high-speed networks; microwave circuit; microwave device; mobile computing; next generation wireless applications; semiconductor technologies; Analog computers; Bandwidth; Computer networks; Dynamic range; Electronics industry; High-speed networks; Microwave circuits; Microwave devices; Mobile computing; Radio frequency;
Conference_Titel :
Wireless Communication Technology, 2003. IEEE Topical Conference on
Print_ISBN :
0-7803-8196-3
DOI :
10.1109/WCT.2003.1321436
